TechSpot
JUNE 15, 2024
The December 2022 patent describes a GPU design split across multiple GPU chiplet sets. Each chiplet has a frontend die paired with several other shader-engine dies. The clever part is that these GPU chiplets can flexibly combine in various configurations.
TechSpot
JUNE 15, 2024
Recently, users have struggled with stability issues related to Intel's Core i9-14900K & 13900K CPUs. Those with the processors have noticed increased game crashing, leading numerous developers to issue support notices. Intel said it would investigate.
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TechSpot
JUNE 15, 2024
In a note to investors this week, Bank of America said, "Consider it a top AI pick." It wasn't talking about Nvidia, even though BofA considers Green Team the undisputed winner of the GPU wars. It was referring to Broadcom, which recently announced a 10-to-1 stock split and better-than-expected revenue.
TechSpot
JUNE 15, 2024
This minuscule chip packs 256GB of storage into a single die using WD's cutting-edge 8th-generation BiCS 3D NAND tech developed jointly with partner Kioxia. The manufacturing technology enables WD to fit 218 layers in a single die, almost twice the 112 layers most NAND flash memory today comes with. By.
Speaker: Tim Sarrantonio, Director of Corporate Brand
Do you really know your donors? Not just what they give, but who they are? 👥 In this interactive session, we’ll break down how nonprofits can use behavioral indicators (affinity, recency, frequency, and monetary value) to build prospecting segments that go beyond wealth screening and actually align with donor identity. You’ll walk away with practical strategies to move beyond basic demographics and cultivate supporters based on how they already engage with you!
TechSpot
JUNE 15, 2024
First up, Samsung took the wraps off two new process nodes aimed at pushing the limits of chip performance and efficiency. The headliner is the 2nm SF2Z process, slated for mass production in 2027. This one packs a clever trick with a backside power delivery network (BSPDN) that routes the.
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